Shenzhen Chinasky Laser Technology Co., Ltd. is one of the most professional manufacturers and suppliers of dual-station glass picosecond laser cutter for glass cutting and spliting in China. Please rest assured to buy high quality dual-station glass picosecond laser cutter for glass cutting and spliting with 2 years warranty from our factory. We also accept customized orders.
introduction
The Glass Picosecond Precision Cutter is a picosecond ultra-short pulse laser precision cutting device engineered for high-precision cold processing of flat glass and brittle transparent hard materials. It is ideal for cutting intricate contours, micro holes, special-shaped patterns, and precision splitting on various glass materials including borosilicate glass, aluminosilicate glass, quartz glass, and coated flat glass.
advantage
Marble Stability Platform: Natural marble base offers micron-level flatness, vibration resistance, and long-term dimensional stability for consistent cutting.
Integrated Cutting & Cleaving: Combines contour cutting and splitting in one machine; supports free-form/complex shapes and 3D curved glass processing.
Dual-Station Continuous Cut & Load: Dual platforms operate in sync: while the laser performs cutting on one platform, you can load and unload materials on the other. This eliminates production downtime, doubling your output to keep your production workflow running continuously.
Picosecond Cold Cutting Technology: Ultra-short picosecond pulses enable heat-free cold cutting of glass. This avoids burn marks, material melting, and minimizes micro-cracks, preserving the strength and safety of your processed materials.
Precision CO₂ Edge Splitting: An integrated secondary CO₂ laser applies controlled heat to split glass perfectly along the pre-cut line. This delivers smooth, clean edges completely free of sharp chips.
All-In-One Integrated Processing: Cutting and splitting are completed in a single pass, with no need to transfer workpieces between separate stations. The fully sealed laser path protects the beam from dust, ensuring long-term accuracy and durability.
Built-In Safety & Automation-Ready: Integrated light barriers trigger an immediate machine stop if any obstruction is detected, ensuring operator safety. The machine can also be easily connected to robot arms and auto-loaders to build a fully automated production line.
Application
Consumer Electronics
- Smartphone/tablet cover glass (Gorilla Glass, Dragontrail)
- Smartwatch lenses, foldable screen glass, and camera lens glass
- LCD/OLED display glass, touch panel glass, and semiconductor packaging glass
Automotive
- Automotive rearview mirrors (convex/curved glass)
- Car display screens, HUD glass, and interior decorative glass
- Automotive sensor glass (LiDAR, camera lenses)
Optical & Photonics
- Optical glass (BK7, fused silica), quartz crystal, and sapphire wafers
- Precision optical lenses, prisms, and optical fiber components
- Laser equipment and medical optical devices
Medical Devices
- Medical glass components (syringe barrels, diagnostic glass)
- Lab-on-a-chip glass, microfluidic devices, and implantable glass parts
Industrial & Semiconductor
- Sapphire substrates for LEDs, semiconductor wafer dicing
- High-precision glass parts for aerospace and instrumentation
- Custom-shaped glass for luxury goods and industrial equipment
FAQ
Q: What materials can this laser cutter process?
A: It processes all brittle transparent materials: optical glass (BK7, fused silica), ultra-clear glass, borosilicate glass, quartz, sapphire (Mohs 9), and 3D/curved glass. It is not suitable for metals or non-transparent polymers.
Q: What is the maximum glass thickness it can cut?
A: Single-pass cutting up to 19mm for ultra-white glass; thicker glass (up to 25mm) can be processed with multi-pass cutting (varies by material and laser power).
Q: How does dual-station operation improve efficiency?
A: While one station processes glass, the other is loaded/unloaded-eliminating idle time. This boosts equipment utilization by ~70% and doubles throughput vs. single-station machines.
Q: What is the cutting precision and edge quality?
A: Positioning accuracy ≤±2μm, kerf width 20–50μm, HAZ <5μm. Edges are smooth, vertical, chipping-free, with no micro-cracks; edge strength is 3× higher than mechanical cutting.
Q: Does it require secondary processing (grinding/polishing)?
A: No-integrated cutting and cleaving produce finished parts with no need for post-processing, reducing production time and costs.
Q: What is the laser source specification?
A: 1064nm infrared picosecond laser, pulse width <15ps, M²<1.2 beam quality; available in 30W/60W/80W power options for different material thicknesses.
Q: Can it handle curved or 3D glass?
A: Yes-with advanced motion control and vision alignment, it precisely cuts free-form, curved, and 3D glass (e.g., smartphone covers, automotive mirrors).
Q: What is the machine's operating environment requirement?
A: Requires a clean, dust-free industrial environment (temperature 18–25°C, humidity 40–60%). It uses water cooling for the laser source; standard power supply is 380V/50Hz three-phase.
Q: Is it compatible with automated production lines?
A: Yes-supports automated loading/unloading modules and can integrate with conveyor systems for 24/7 unmanned production.
Q: What is the typical service life of key components?
A: Laser source: ~20,000 hours; linear motors/optical scales: >50,000 hours; marble platform: permanent stability with minimal maintenance.
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Technical Parameters
| Model | HT-CP50-7060D | HT-CP50-7060S |
| Category | Dual-Platform Glass Cutting & Splitting Function Laser Machine | Single Platform Glass Cutting Laser Machine |
| Cutting Laser Source | ||
| Laser Type | Picosecond Pulse Laser | |
| Power | 50W (Optional: 30W/60W/80W) | |
| Wavelength | 1064 nm, Beam Quality: M2 < 1.3 | |
| Pulse Width | <10PS | |
| Cooling Method | Water Cooling | |
| Cutting Head | ||
| Focusing Head | Top brand Lens Focusing Head | |
| Cutting Head Quantity | Single Head | |
| Focus Spot Size | <2μm | |
| Cutting Performance | ||
| Cutting Speed | 0-500 mm/s Adjustable | |
| Cutting Thickness | ≤19 mm (Thickness may vary depending on material) | |
| Minimum Cutting Edge | <5μm | |
| Cutting Accuracy | ≤20μm | |
| X/Y Cutting Range | 600mm x 700mm Dual Platform | 600mm x 700mm Single Platform |
| Splitting Laser Source | ||
| Laser Type | Continuous Laser | None (Optional external splitting device) |
| Power | 150W (Optional: 100W/120W/300W) | |
| Wavelength | 10.6μm | |
| Pulse Width | Pulse Frequency: 1Hz-100kHz | |
| Cooling Method | Water Cooling | |
| Focusing Lens | F=63.5 | |
| Splitting Head | ||
| Splitting Head Quantity | Single Head | None |
| Focus Spot Size | 3mm (Reference: 2-5mm, adjustable based on splitting thickness) | |
| Electrical Platform | ||
| X/Y Drive System | Direct Drive Motor, 0.1μm Digital Grating Scale | |
| X/Y Travel Range | X=1200mm, Y=700mm | X=700mm, Y=600mm |
| X/Y Movement Speed | Maximum 1000 mm/s, acceleration 1 G | |
| X/Y Repeat Positioning Accuracy | ≤±2μm | |
| X/Y Positioning Accuracy | ≤±1μm | |
| Z-Axis Drive System | Servo Motor | |
| Z-Axis Travel Range | 100mm | |
