Shenzhen Chinasky Laser Technology Co., Ltd. is one of the most professional manufacturers and suppliers of uv laser cutting machine in China. Please rest assured to buy high quality uv laser cutting machine with 2 years warranty from our factory. We also accept customized orders.
Feature and Advantage
Broad Material Compatibility
Effectively processes materials that are difficult with other lasers, including plastics, ceramics, glass, and highly reflective metals like copper and aluminum.
Advanced Motion Systems
High-precision linear motors and galvanometer scanners provide unmatched speed and accuracy for complex cutting paths.
Integrated Vision Alignment
High-resolution cameras automatically locate and align cuts to fiducial marks or patterns, ensuring critical accuracy for PCB and semiconductor components.
Optimized Processing Areas
Features a generous 460 mm x 460 mm maximum laser working range for large panels or multiple arrays, alongside a precision 50 mm x 50 mm small-feature processing area. This dual-range capability provides unparalleled flexibility, from processing large-format materials down to machining extremely intricate, miniature components with high accuracy.
Intelligent Process Database
A comprehensive database allows clients to build and save unique cutting parameter libraries for every product. This eliminates manual mistakes and ensures flawless, repeatable results regardless of operator experience.
High-Speed Precision Motion System (XY-Axis)
Equipped with a high-performance motion platform offering a rapid speed of 800 mm/s and a high 1G acceleration. This ensures fast positioning and drastically reduces non-cutting idle time, significantly boosting overall throughput and efficiency for both small and large batch production.
Streamlined Software Operation
The software interface includes intuitive functions like "Selective Cutting," "Tool-Based Cutting," and "Material-Specific Parameter Presets." This simplifies complex job setup into a few clicks, minimizing operator training time and preventing errors.
Automated Production History & Recall
The system automatically records the complete cutting data for every product. To switch jobs, operators simply select the product name from a list to instantly recall all parameters, enabling rapid changeovers and eliminating setup errors for proven products.
Advanced Operator Management & Audit Trail Provides
Administrators with powerful monitoring tools. The system automatically logs all operator activity, including login/logout times, every parameter change made, and a complete history of cut files used. This ensures full traceability and accountability and aids in quality control diagnostics.
Application
- Semiconductor & IC Packaging: Wafer dicing (singulation), silicon cutting, ceramic substrate cutting, and processing of lead frames.
- Flexible Electronics (FPC): Precise cutting and drilling of Flexible Printed Circuits (FPC), coverlays, and thin polyimide (PI) and PET layers.
- Precision Engineering: Cutting thin metals (copper, aluminum foils), creating micro-electromechanical systems (MEMS), and fabricating fine meshes and filters.
- Consumer Electronics: Cutting glass and sapphire for camera modules, touch sensors, and display components; marking and trimming smartphone components.
FAQ
Q: How does a UV laser cut differently from a CO2 or fiber laser?
A: CO2 and fiber lasers primarily use heat to melt or vaporize materials but UV laser uses a "cold" process called photo-ablation. Its short wavelength and high photon energy break the molecular bonds of the material directly, removing material precisely with minimal heat transfer to the surrounding area.
Q: What materials can a UV laser cut best?
A: UV lasers excel at cutting a wide range of delicate and challenging materials, including:
● Plastics & Polymers: Polyimide (PI), PET, PEEK, PTFE, and other engineering plastics.
● Thin & Reflective Metals: Copper, aluminum, gold, and silver foils without reflecting the beam.
● Ceramics: Alumina, zirconia, and other substrate materials without micro-cracking.
● Glass & Sapphire: For clean, controlled cuts and drilling without shattering.
● Semiconductor Materials: Silicon, gallium arsenide, and other compound semiconductors.
Q: How accurate is a UV laser cutting machine?
A: The precision of a UV laser cutting machine is extremely high. The smallest focal light spot can be below 20 um, and the cutting edge is very small. Machines can achieve a positioning accuracy of ±3 um and a repeat accuracy of ±1 um, with a system processing accuracy of ±20 um.
Q: What are the primary advantages of the "cold cutting" process?
A: The key advantages are
- No Thermal Damage: Eliminates burning, melting, and heat-induced deformation.
- Superior Edge Quality: Produces smooth, straight walls with no burrs or slag.
- Minimal HAZ: Protects the integrity of the material surrounding the cut.
- Ability to Cut Heat-Sensitive Materials: Enables processing of materials that would be destroyed by thermal lasers.
Q: What is the typical thickness range for materials cut with a UV laser?
A: UV lasers are optimized for ultra-precision work on thin and delicate materials. The ideal range is typically from 1 micron up to 1-2 mm, depending on the material's properties. They are not designed for cutting thick metal plates or blocks.
Q: Is the UV laser system safe to operate?
A: Absolutely. The laser is fully enclosed in a safety interlocked cabinet, ensuring no harmful UV radiation can escape during operation. Operators can safely load and unload parts without any risk of exposure.
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Technical Parameters
|
Model |
HT-UVC15 |
|
Laser power |
15 W |
|
Laser type |
UV Laser |
|
Laser wavelength |
355 nm |
|
Single Process Area |
50×50 mm |
|
Total Processing Range |
460 mm × 460 mm (Customizable) |
|
CCD Auto-Alignment Accuracy |
±3 μm |
|
Auto-Focus Function |
Yes |
|
XY-Axis Repositioning Accuracy |
±1 μm |
|
XY-Axis Positioning Accuracy |
±3 μm |
|
Supported File Formats |
DXF, DWG, GBR, CAD and more |
